According to the provided reference, a specific type of Ball Grid Array package, the PBGA (Plastic Ball Grid Array), is available in a range of sizes rather than a single exact size.
The reference states that the PBGA package is offered in various dimensions to accommodate different design needs and pin counts.
PBGA Size Range and Characteristics
Based on the information provided in the reference, the PBGA package exhibits the following characteristics:
- Size Range: From 17mm x 17mm to 35mm x 35mm
- Ball Pitch Options: Available in 0.8mm and 1.0mm pitches.
- Ball Count: Ranging from 208 to 976 balls, depending on the specific size and pitch.
These varying sizes allow manufacturers to choose a PBGA package that best fits the requirements of a particular electronic component and its application, balancing factors like performance, board space, and cost.
Understanding BGA Package Sizes
It's important to note that the "size" of a Ball Grid Array can refer to the physical dimensions of the package itself. Different types of BGA packages exist (like PBGA, CBGA - Ceramic BGA, FBGA - Fine-pitch BGA, etc.), and each type, as well as specific package designs within that type, will have its own range of available sizes, ball pitches, and corresponding ball counts. The size is typically driven by the complexity of the integrated circuit inside and the number of electrical connections (balls) required.
Therefore, while the reference specifies a range for PBGA packages, the exact size of a ball grid array depends on the specific package type and its technical specifications.
