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What is a Dry Film Soldermask?

Published in PCB Manufacturing 2 mins read

A dry film soldermask (DFSM) is a permanent, water-based or solvent-based material used in printed circuit board (PCB) manufacturing, supplied in rolls, typically with thicknesses of 75μm or 100μm. It serves as a protective coating applied to PCBs.

Key Aspects of Dry Film Soldermask:

  • Composition: DFSM can be either water-based or solvent-based. This difference impacts the application and development process.

  • Form Factor: It's supplied in rolls, making it suitable for automated application processes.

  • Thickness: Common thicknesses are 75μm and 100μm, allowing for adequate protection without adding excessive bulk.

  • Application: DFSM is applied to the PCB surface using lamination equipment. This ensures uniform coverage and proper adhesion.

Functions of Dry Film Soldermask:

  • Protection Against Oxidation: It shields the copper traces on the PCB from oxidation, preventing corrosion and maintaining conductivity.

  • Prevention of Solder Bridges: During the soldering process, DFSM prevents solder from bridging between closely spaced pads. This is crucial for ensuring the reliability of surface mount components.

  • Electrical Insulation: It provides electrical insulation, preventing short circuits and signal leakage.

Advantages of Using Dry Film Soldermask:

  • High Resolution: DFSM allows for very fine feature sizes and precise registration.
  • Consistent Thickness: Uniform thickness ensures reliable performance across the entire PCB.
  • Good Chemical Resistance: It can withstand various chemicals used in PCB manufacturing processes.
  • Automated Application: The roll format facilitates automated application.

Application Process:

  1. Cleaning: The PCB surface is thoroughly cleaned to remove any contaminants.
  2. Lamination: The dry film soldermask is laminated onto the PCB using heat and pressure.
  3. Exposure: The laminated PCB is exposed to UV light through a photomask. The photomask defines the areas where the solder mask will remain.
  4. Development: The unexposed areas of the dry film are removed in a developing solution.
  5. Curing: The remaining solder mask is cured using heat or UV light to harden and provide its protective properties.

In summary, dry film soldermask is a crucial component in PCB manufacturing, providing protection, insulation, and solderability control, ultimately ensuring the reliability and performance of electronic devices.

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