The term "standard solder mask" is somewhat ambiguous without further context. It generally refers to the most common type of solder mask applied to printed circuit boards (PCBs), and the parameters associated with it depend on the fabrication method used. Considering common manufacturing constraints, a standard solder mask can be defined based on its application method and associated clearances.
Here's a breakdown based on different aspects:
Solder Mask Application Methods & Their Standards:
Two common methods impact what's considered "standard":
- Screen Printing: This is a less precise, and thus generally standard, method in some contexts because it's often more cost-effective.
- Photoimageable Resist (LPI): This offers higher precision and is standard in applications requiring finer detail.
Standard Clearances Based on Application:
| Application Method | Standard Clearance | Characteristics |
|---|---|---|
| Screen Printing | ~0.38 mm spacing | Less precise, wider features, typically more affordable. |
| Photoimageable Resist (LPI) | 75–125 µm clearances (0.075-0.125mm) | Higher precision, finer features, more complex. |
Therefore, the "standard" solder mask depends heavily on the manufacturing method and the required precision for the specific PCB design. If the design allows for wider clearances, screen printing might be the standard choice. If finer details are needed, LPI is the standard.
In summary, there isn't one universal "standard" solder mask; it depends on the context of manufacturing capabilities and design requirements. When discussing standard solder mask, it's important to specify the application method and associated clearance specifications.
