A mirror finished wafer is prepared through a multi-step process that involves slicing, polishing, and cleaning the semiconductor crystal.
Based on the provided information, the preparation of a wafer to achieve a mirror-like finish involves the following key steps:
- Slicing: Once the crystal is grown, it is sliced into thin wafers using a diamond saw.
- Polishing: The sliced wafers are then polished to a mirror-like finish. This critical step is what gives the wafer its highly reflective surface.
- Cleaning: After polishing, the wafers are cleaned to remove any impurities, ensuring a pristine surface ready for subsequent manufacturing processes like photolithography.
This sequence of slicing, polishing, and cleaning results in the prepared wafer with the desired mirror finish.
